NTD20N06-001【PDF 1/7 页】MOSFET N-CH 60V 20A IPAK

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NTD20N06, NTDV20N06

Power MOSFET

20 Amps, 60 Volts, N ? Channel DPAK

Designed for low voltage, high speed switching applications in power

supplies, converters and power motor controls and bridge circuits.

Features

? Lower R DS(on)

? Lower V DS(on)

? Lower Capacitances

? Lower Total Gate Charge

? Lower and Tighter V SD

? Lower Diode Reverse Recovery Time

? Lower Reverse Recovery Stored Charge

? AEC Q101 Qualified ? NTDV20N06

? These Devices are Pb ? Free and are RoHS Compliant

V (BR)DSS

60 V

http://onsemi.com

R DS(on) TYP

37.5 m W

N ? Channel

I D MAX

20 A

Typical Applications

? Power Supplies

? Converters

? Power Motor Controls

? Bridge Circuits

MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)

MARKING

DIAGRAM

Rating

Drain ? to ? Source Voltage

Symbol

V DSS

Value

Unit

Vdc

Drain

Drain ? to ? Gate Voltage (R GS = 10 M W )

Gate ? to ? Source Voltage

? Continuous

? Non ? repetitive (t p v 10 ms)

Drain Current

? Continuous @ T A = 25 ° C

? Continuous @ T A = 100 ° C

? Single Pulse (t p v 10 m s)

V DGR

V GS

I D

I DM

" 20

" 30

Vdc

Adc

Apk

1 2

DPAK

CASE 369C

STYLE 2

Gate

Drain

Source

Total Power Dissipation @ T A = 25 ° C

Derate above 25 ° C

Total Power Dissipation @ T A = 25 ° C (Note 1)

Total Power Dissipation @ T A = 25 ° C (Note 2)

Operating and Storage Temperature Range

P D

T J , T stg

0.40

1.88

1.36

? 55 to

175

W/ ° C

° C

20N06

= Device Code

= Year

= Work Week

= Pb ? Free Package

Single Pulse Drain ? to ? Source Avalanche

Energy ? Starting T J = 25 ° C

(V DD = 25 Vdc, V GS = 10 Vdc,

L = 1.0 mH, I L (pk) = 18.4 A, V DS = 60 Vdc)

Thermal Resistance

? Junction ? to ? Case

? Junction ? to ? Ambient (Note 1)

? Junction ? to ? Ambient (Note 2)

Maximum Lead Temperature for Soldering

Purposes, 1/8 ″ from case for 10 seconds

E AS

R q JC

R q JA

T L

170

2.5

110

260

° C/W

° C

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 2 of this data sheet.

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. When surface mounted to an FR4 board using the minimum recommended

pad size.

2. When surface mounted to an FR4 board using the 0.5 sq in drain pad size.

? Semiconductor Components Industries, LLC, 2011

August, 2011 ? Rev. 8

Publication Order Number:

NTD20N06/D

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